product features:

·Easy to install and use ·Fast processing speed ·Standard or customized handling bins ·Degree of vacuum ·Process gas ·Process control ·節約成本 ·Plasma treatment under vacuum pressure ·Uniquely designed warehouse door

When the pressure in the vacuum processing chamber is 2 to 12 mbar, which is close to the vacuum, the discharge ions generated by the plasma electrode act on the surface of the object and process it. The processing cycle is generally very short, depending on the product material, the time is between 2-120s.

VacuTEC has simple operation, high reliability and fast processing speed. The process gas used in the treatment process can also be argon, oxygen and other gases, but in most cases, because conventional air can also generate powerful energy, you can achieve satisfactory treatment results without using these process gases.

Tantec uses advanced HV-X series discharge generators, and the transformers are also specially designed based on the plasma electrodes.

Features：
·Simple installation and use Connect power and compressed air units
·Fast processing speed Depending on the material properties and power, the processing time is 20-180s.
·Standard or customized processing bins Processing bins and trays can be designed for different applications.
·Vacuum degree Depending on the application, a plasma discharge can be generated at 1-12mbar.
·Process gases Process gases such as oxygen and argon can be used, but are not necessary in most cases.
·Process control The plasma processing process is controlled by the HV-X series discharge generator and PLC device. All parameters are displayed on the touch panel (standard-proface touch screen).
·Cost saving Low power consumption, no process gas, low cost, is the best solution to improve the wettability and adhesion of the surface of objects.
·Plasma treatment under vacuum can treat both conductive and non-conductive surfaces.
·Uniquely designed door The standard door can be opened manually or automatically.